By A. Fletcher
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Additional info for Advanced Organics for Electronic Substrates and Packages
The company also indicated that alleged Japanese dumping of GaAs components was a factor in the decision. Siemens AG has declined to purchase the Wacker operation which some industry figures see as an indication that this view of GaAs shared by such a major European electronics manufacturer. The number of papers in the scientific and technical press should not be taken as an indication of the commercial applications or the value of the market. It is inevitable that new developments should cause the greatest interest but the largest share of the market will continue to be held by such established materials as epoxies for many years.
Towa Precision Industry Ltd in Japan has developed a single mould with several resin pots served by a corresponding number of plungers to eliminate long runners and give shorter paths from pots to cavities. The conventionally used B-stage resins give a cure time of 1 to 2 minutes and a relatively high output. The Towa process requires less gel and so shortens cure times. Higher yields can also be achieved by automating such processes as mould unloading, cleaning and reloading. Problems are experienced in adapting transfer moulding to the TAB process which is attractive as a continuous, automated operation.
The purpose of encapsulation is to protect IC devices and prolong their reliability without affecting performance. Moisture, mobile ion contamination, ultraviolet, visible and alpha radiation and hostile environments are some of the possible modes of degradation which can impact on the performance or lifetime of the device. Moisture and the associated electrooxidation and metal migration are a major source of corrosion for IC devices. The diffusion rate of moisture is dependent on the encapsulant material.